ACS applied materials & interfaces · ·Added 10 Nov 2026

Hierarchically Porous PDMS/ZIF-8@h-BN Bilayer Composite Membrane Enabling Synergistic Passive Daytime Radiative Cooling and Efficient Thermal Conduction for Electronic Thermal Management.

Xi-di Liu, Qin-Ru Pu, Guo-Rui Zhang, Jian-She Xia, Jing-Hui Yang, Yong Wang

DOI ↗

Abstract

The advancement of 5G and emerging 6G communications drives the integration and miniaturization of outdoor electronics, triggering an exponential surge in chip heat flux and severe challenges for low-energy passive thermal management. Passive daytime radiative cooling (PDRC) has emerged as a novel zero-energy cooling technology. Herein, a bilayer PDRC composite (B-PDRC) integrating radiative cooling and in-plane thermal conduction is designed and fabricated. The top radiative cooling layer is a hierarchically porous Polydimethylsiloxane (PDMS)/zeolitic imidazolate framework-8 (ZIF-8) foam prepared via a template-sacrificial method combined with vacuum impregnation, while the bottom thermally conductive layer is a PDMS/hexagonal boron nitride (h-BN) dense film fabricated by solution casting. The multiscale scattering induced by micron-sized pores and 600-800 nm ZIF-8 nanoparticles delivers a high solar reflectance of 94.45%, and the C-N bonds of ZIF-8 boost the average atmospheric window emissivity to 93.22%, compensating for the emissivity valley of neat PDMS. The h-BN fillers construct continuous thermal conduction paths, elevating the in-plane thermal conductivity to 0.92 W m-1 K-1 at 20 wt % of h-BN, a 179% enhancement compared to neat PDMS. Indoor tests demonstrate a maximum temperature drop of 11.9 °C for a charging smartphone covered with B-PDRC. Outdoor measurements under sunny conditions achieve a maximum subambient cooling of 8.8 °C, and a 14.8 °C temperature reduction for an operating smartphone. Furthermore, B-PDRC exhibits excellent hydrophobic self-cleaning performance (water contact angle of 135.4°), flexibility, mechanical robustness, long-term durability under UV and humid conditions, and universal adhesion to various substrates. This work provides a feasible design strategy for high-performance flexible PDRC composites for thermal management of outdoor electronic devices.

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