Lightweight MXene–B₄C–Polyimide Nanocomposite for Simultaneous Cosmic Radiation and Electromagnetic Interference Shielding in Aerospace Avionics
Abstract
At cruise altitudes, atmospheric proton radiation and electromagnetic interference (EMI) jointly threaten the reliability of flight-critical avionics. Conventional protection strategies typically address these hazards separately through aluminum- or lead-based radiation barriers and conductive copper-mesh EMI shields, increasing enclosure mass, volume, and integration complexity. To address this limitation, we present a lightweight dual-function MXene (Ti₃C₂Tₓ)–B₄C–polyimide nanocomposite that combines proton attenuation and EMI shielding within a single conformal material system. The framework integrates SRIM/TRIM-guided compositional design, controlled nanocomposite fabrication, proton-beam testing, broadband EMI characterization, and aerospace-relevant environmental validation. SRIM/TRIM simulations show that a boron-rich composition of 31 at% achieves complete stopping of 50 MeV protons at approximately 36 mm bulk thickness, with electronic stopping dominating energy loss and negligible backscattering. Surface-functionalized B₄C nanoparticles (~ 45 nm) and exfoliated MXene nanosheets are incorporated through solution casting and vacuum-assisted filtration. At 20 wt% B₄C and 15 wt% MXene, the 36 mm composite achieves 100% proton attenuation, approximately fivefold higher than an aerospace-grade aluminum reference, and 54.7 dB EMI shielding across the X-band (8.2–12.4 GHz). Electrical conductivity reaches 2.1 × 10⁴ S/m, flexibility is retained to a 2 mm bend radius, and areal mass is reduced by ~ 81% relative to a 2.0 mm aluminum reference. Selected RTCA DO-160G-aligned tests confirm performance retention after 500 thermal cycles and 1,000 h humidity exposure. MCNP6.2 simulations further project an eightfold reduction in processor radiation dose. Overall, the optimized composition balances proton attenuation, EMI shielding, flexibility, and mass efficiency within aerospace-relevant thickness constraints, supporting lightweight multifunctional protection for aerospace electronics.
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